355nm UV laser
Uv laser e na le melemo e meraro e ikhethileng lits'ebetsong tsa micromachining:
●The wavelength e khutšoanyane e ka sebelisoa ho sebetsa likarolo tse nyenyane haholo.The beam diffraction effect ke lebaka le ka sehloohong la ho fokotsa boholo ba likarolo.
●Li-photon tse nang le matla a phahameng li ka senya ka ho toba likamano tsa lik'hemik'hale tsa limolek'hule tse ka hare ho thepa.Ts'ebetso ena e bitsoa "bata" process process.Ha ho bapisoa le laser e bonahalang le laser ea infrared, sebaka se amehileng ke mocheso se batla se sa tšoanelehe.
●ka tlhaho boholo ba lisebelisoa li ka monya leseli la ultraviolet, litšobotsi tsa eona li etsa hore laser ea UV e khone ho sebetsana le lisebelisoa tse ngata tse bonahalang tsa laser le infrared laser processing.
●Pheta sekhahla se feto-fetoha
●Kantle e laolehang
●Ho bonolo ho sebelisa & tlhokomelo mahala
●Ts'ebetso ea nako e telele
●Bokgoni bo phahameng
●Ho tšepahala ho phahameng
Lipontšo tsa tekheniki
Mohlala No. | GT-355-50 |
Wavelength | 355+/-1nm |
Mokhoa oa Sebaka | haufi le TEM00 |
Output Power(average) | >1, 5, 10,…, 50mW |
Mokhoa oa ts'ebetso | Laser e otlolohileng |
Matla a pulse a le mong | 1-10uJ |
Pulse Width | 5-10ns |
Peak Power | 100W ~ 2KW |
Pheta sekhahla | 1-10KHz |
Polarization | > 50:1 |
Sebopeho sa Beam Spot | Sedikadikwe, karolo ya karo-karolelano<1.1:1 |
Ho supa Botsitso | <0.05 mrad |
Beam Diameter(1/e2) | 2mm |
Phapang ea Beam | <1.5 mrad |
Beam Height ho tloha Base | 45 limilimithara |
Botsitso ba Matla* | <± 5% ka lihora tse 4 |
Mocheso Ho tsitsisa | TEC |
Nako ea ho futhumatsa | <5 metsotso |
Mocheso o nepahetseng oa ho sebetsa | 20-30oc |
Mocheso oa polokelo | 10-50oC |
MTTF** | 10,000 lihora |
Litekanyo | 211(L)x88(W)x74(H) mm³ |
Phepelo ea motlakase | C. Mofuta o ka fetolehang oa Lab : 178(W)x197(D)x84(H) mm³ |
Ho taka hlooho ea laser
Mofuta o ka feto-fetohang oa Lab